Science & ResearchJul 17, 2026
Subgrain-resolved Analysis of Degradation in Cu Metallization via Scanning 3DXRD and Thermomechanical Modeling
Metallization layers play a key role in the performance and reliability of modern power semiconductor devices.
Metallization layers play a key role in the performance and reliability of modern power semiconductor devices. During short-circuit events, rapid heating of power metallization layers induces thermomechanical incompatibility stresses, which may contribute to material degradation…
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